Suss MA6 contact aligner, weekly,
Heidelberg laser writer, weekly (alternating the 4 mm and 20 mm heads)
SAMCO 800 etcher, weekly
Angstrom evaporator, weekly
K&S Au wire bonder, weekly
Tystar furnace, 5 processes in all 4 tubes: monthly
Process control charts may be found on the equipment description page o
Laurell spinner is capable of handling both masks and wafers. There are 4 recipes available:
1). 300MIF30s: Develop with 300MIF for 30s
2). 300MIF60s: Develop with 300MIF for 60s
3). AZ400K30s: Develop with AZ400K:D.I. H2O=1:4 fo
The new power level is set to 90% (was 60%);
Spot size correction: x = -200nm; y = -200nm (was x = -150nm; y = -150nm);
Depth of Focus remains the same as before (DeFoc = 1950).
The above correction is based on developing the mask using the "AZ400KMask"
recipe on Laurell spinner, and etching it with "Program #1" on Polos spinner.
With the above setup/parameters, minimal features as small as 1um i
Tystar Polysilicon Tube (#2) Down
The Tystar Polysilicon Tube (#2) is down due to excessive gasket leakage. The gaskets around the silane injection ring appears to have aged and hardened so that an adequate seal is not made to the quartz tube surface. The tube will have to be cooled to room temperature, the door disassembled, all the gaskets replaced, the door reassembled, the tube leak checked, and the tube reheated. This is tentatively scheduled for Wednesday and Thursday, May 25th and 26th.