Angstrom Dielectric Sputter System
Manufacturer: Angstrom Engineering
Equipment: Sputter Coater
-Sputter dielectric films AlN, SiO2, SiNx, Al2O3, ZnO, Si3N4, TiO2, MnO, NiO, Fe2O3, CoO
Operating Instructions and Training:
Please follow the provided authorization and training form.
For additional information regarding this machine, please contact the PRISM Staff at: MNFL-Staff@princeton.edu.
This is a RF magnetron, confocal sputtering system, used for depositing dielectrics. It has three guns, three targets, and three power supplies with the maximum output power of 500 W. Two separate gas lines with two MCFs are available. First gas line (Gas 1) goes to the chamber. The second gas line (Gas 2) feeds to the chimney of the guns. Argon is connected to Gas 1 and O2 to Gas 2. The system is pumped by a turbo pump backed by a mechanical pump. A gate valve separates the vacuum chamber from the pump.
Targets available: CoO, MnO, NiO, ZnO, ZnO w/ 2% Al2O3, Fe2O3, SiO2, TiO2,and Al2O3. No Indium is allowed in this system.