Princeton University

Manufacturer: STS
Classification: Dry Etch
Equipment: STS ICP Metal Etcher
Uses:

The STS is a state of the art inductively coupled plasma etcher (Figure 1). The tool has been configured to enable users to etch Al, Cr, Ti, W, and Nb with a photoresist mask. The tool is plumbed with SF6, CHF3, Ar, O2, Cl2 and BCl3 gases. It possesses a He mechanically clamped backside cooled chuck that is temperature controlled with a chilled water circulator.

Specimens are loaded into the process chamber by a robot arm through a load lock to minimize contaminants entering the process chamber and to protect users from hazardous etch by-products. SEMI standard 100 mm diameter wafers can be processed in the system. Samples that are smaller than 100 mm in diameter must be mounted on a carrier wafer.

There are 2 RF power sources to control the properties of the plasma. The first is a 1000W supply inductively coupled to the gas in the process chamber. It generates a high density of radicals and ions with only a small potential between the plasma and the wafer surface. An additional 500W source induces a potential between the chuck and the plasma just like a traditional RIE system. The advantage of this combination is that the plasma density and the substrate bias can be independently controlled.

The system is controlled by a programmable controller mounted on the wall behind the tool. The user interface is a touchscreen mounted on the front of the electronics rack.

Click here to view a map to STS.
 

Please contact MNFL staff for training.

Operating Instructions (STS ICP Metal Etcher)

Short Operating Instructions (STS Metal Etcher)

 

For additional information regarding this machine, please contact the PRISM Staff at: MNFL-Staff@princeton.edu.