Buehler / Minimet 1000 Polisher
Equipment: Polisher, grinder
-Grinder, polisher for small wafers
Operating Instructions and Training:
Please follow the provided authorization and training form.
For additional information regarding this machine, please contact the PRISM Staff at: MNFL-Staff@princeton.edu.
General Information and Usage
Minimet 1000 can be used for precision thinning and mirror polishing required for different applications, e.g., polishing of small wafers (Si, GaAs, …). It has two attachments allowing either polishing of small wafers, or precision thinning and mirror polishing. The wafer polishing attachment holds wafer up to 24 mm across. The precision thinning attachment can handle samples up to 12 mm across. To remove material, the specimen is placed on a variably loaded arm that moves in a circular geometric pattern bounded by a stationary polishing bowl. Material removal is done by a grinding disc, or by a combination of abrasive/lapping/polishing cloth and glass backing disk, placed on the bottom of the bowl. The user can control the speed of the arm motion from 0 to 50 rpm, the force of the arm from 0 to 10 lb, and the polishing/grinding duration. A variety of diamond grinding disks, abrasive papers, polishing powders and suspensions, lapping films, and polishing cloths are available.
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