Cambridge NanoTech Savannah 100 Atomic Layer Deposition System
Manufacturer: Cambridge NanoTech
Equipment: Atomic layer deposition
-Deposition of Al2O3
Operating Instructions and Training:
Please follow the provided authorization and training form.
For additional information regarding this machine, please contact the PRISM Staff at: MNFL-Staff@princeton.edu.
General Information and Usage
The Savannah 100 Atomic Layer Deposition (ALD) system is used for the deposition of aluminum oxide on silicon. This is achieved by pulsing between the precursor, trimethylaluminum (TMA) and water vapor. Atomic layer deposition is a self-limiting process capable of precise monolayer growth. The system can handle wafers up to 4 inch diameter. The maximum deposition temperature is ~ 300ºC.
Cleaning procedure for samples: This cleaning procedure must be followed for all materials without exception. A minimum of 3 times each of TCE (tricloroethylene), acetone, methanol, and DI water, including handling tools and carriers. RCA clean is preferred.
Prohibited materials: indium, tin, zinc, iron, and organics (any type of resist, BCB, polyimide, epoxy, tape, vacuum grease, rubber, plastic, etc.)
Click here to view a map to the Savannah 100 ALD system.