Flip Chip Bonder
Manufacturer: Research Devices
Equipment: Flip Chip Bonder
Operating Instructions and Training:
Please follow the provided authorization and training form.
For additional information regarding this machine, please contact the PRISM Staff at: MNFL-Staff@princeton.edu.
The M 8 Research Devices bump bonder is for the alignment, heating and compression of samples to enable both a physical and electrical connection between two devices via Indium "bumps." The bonder is capable of 200g to 20kg pressure, has a 3 degree pitch and roll, and a 7 degree theta range along with the ability of reaching 400C. Samples are aligned via CCD cameras, and can be as large as 5x5 cm.
Click here for a map to the Flip Chip Bonder.