Flip Chip Bonder
Manufacturer: Research Devices
Equipment: Flip Chip Bonder
Use: Device bonding
The M 8 Research Devices bump bonder is for the alignment, heating and compression of samples to enable both a physical and electrical connection between two devices via Indium "bumps." The bonder is capable of 200g to 20kg pressure, has a 3 degree pitch and roll, and a 7 degree theta range along with the ability of reaching 400C. Samples are aligned via CCD cameras, and can be as large as 5x5 cm.
Click here for a map to the Flip Chip Bonder.
Operation Instructions and Training
Please follow the provided authorization and training form.
Contact Information for Users
For additional information regarding this machine, please contact the PRISM Staff at: MNFL-Staff@princeton.edu.