K&S Wire Bonder
Manufacturer: Kulicke & Soffa
Equipment: Wire Bonder
-Connecting devices to test points via 1 mil Au ribbon
Operating Instructions and Training:
Please follow the provided authorization and training form.
General Information and Usage
Click here for a map to the K&S Wire Bonder.
Process Control Chart
Process: The pull test data represents the average force in grams it takes to break 10 bonded wires. The wire is 25um (0.001”) Au. The wires are placed upon a 525um Si wafer layered with 200nm of Au over 10nm of Ti (deposited by the Angstrom Ebeam Evaporator). The power/time/force settings of the bonder are 1.9/5.0/5.0, respectively. A Terra Universal Wire Bond Strength Tester (model: 9104) was used to conduct the tests.